Do moldable applications perform better on failure-prone HPC platforms?

TitleDo moldable applications perform better on failure-prone HPC platforms?
Publication TypeConference Proceedings
Year of Publication2018
AuthorsLe Fèvre, V., G. Bosilca, A. Bouteiller, T. Herault, A. Hori, Y. Robert, and J. Dongarra
Conference NameResilience: 11th Workshop on Resiliency in High Performance Computing in Clusters, Clouds, and Grids, jointly published with Euro-Par 2018
Series TitleLNCS
PublisherSpringer Verlag
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