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Le Fèvre, V., G. Bosilca, A. Bouteiller, T. Herault, A. Hori, Y. Robert, and J. Dongarra, Do moldable applications perform better on failure-prone HPC platforms?,” 11th Workshop on Resiliency in High Performance Computing in Clusters, Clouds, and Grids, Turin, Italy, Springer Verlag, August 2018.  (360.72 KB)